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    Laser Machines for Failure Analysis Labs

    FALIT? Laser Systems

    for semiconductor failure analysis lab, forensic science lab research

    FALIT? - Failure Analysis Laser Inspection Tool, pronounced as "F-A-Light"

    The FALIT?

    CLC’s laser micromachining technology rooted in the world 1st wafer laser processing system in 1972. Since then, we’ve continued to evolve this technology in collaboration with our customers.

    Patent and?Trademark?registered in 2004

    Build & Quote Now

    Failure Analysis Laser Inspection Tool

    Major users?are the failure analysis labs in the semiconductor industry, intelligent automotive industry, and forensic labs in law enforcement departments.

    Our FALIT? Customers


    FBI, CIA, USSS, Sandia lab, NavyAir, Idaho National Labs, Raytheon, Honeywell, RCMP, NSW Police, ETTK, HKSTP, AIST, DENSO, ASMO, AISIN, TOYOTA, MITSUBISHI, APPLE, FORD, Intel-Altera, CISCO, Infineon, TI, Qualcomm, NXP-Freescale, On-semi, Fairchild, Vishay, ST Micro, Broadcom-LSI, Skyworks, SanDisk, Analog Devices, ASE, Amkor, SPIL, Winbond, Maxim, Micron, TDK, Torex, ROHM, Sumitomo, Yazaki, Tanaka, NJR, Hakuto

    FALIT? Laser Applications


    Materials in the Semiconductor Industry

    It adapts to the widest range of epoxy mold compound and various types of fillers, keeping gold, silver, brass, or aluminum bonding wire, the silicon, GaAs, InP die undamaged.

    If you’re not sure if your material will work, send it in for a free material testing study by our application experts.

    Free Material Testing Study

    Computer Chip Laser Decapsulation Failure Analysis

    Laser Technology Refined

    This application can fully or partially replace traditional micro-drilling, sawing, and chemical etching processes. The FALIT? provides fast and accurate solutions for IC de-capsulation, cross-sectioning, and de-lidding, expose the insides from ceramic, KOVAR, gel, and mold compound capsulation, expose defective bonding wires, observe solder ball mid-position and lamination cracks, and more evidence of failure.

    Versatile Laser Machines

    With the FALIT? laser?micromachining?technology, users can easily resolve the many challenges in IC chip failure analysis of new packaging patterns and material. This system significantly saves setup and processing time, and the cost of building infrastructure for expensive acid protection labs.

    Computer Chip Laser Decapsulation Failure Analysis

    Features of the Systems Include


    FALIT Duo

    The FALIT? comes in many configurations to meet your needs in semiconductor failure analysis. From tabletop options to multi-laser configurations. Our patented laser technology is the best solution for failure analysis labs.

    Specialized Laser Source

    Specialized Digital ICO Laser Source for the toughest of mold compounds. Designed specifically for this type of application to achieve the best possible results.

    Continuous Motorized Zoom

    High-resolution continual motorized vision system for inspecting micro components and filler compounds. Used for pin-point laser removal of mold and gel compounds.

    Video Microscope

    See exactly where the laser will remove compounds using the vision system. Control the exact position throughout the process.

    Acid Gasket Cutting Software

    Create your own gaskets quickly and effectively using the Acid Gasket Cutting module available for the FALIT? brand.

    We recommend potential customers to send in their materials for testing in order to configure the best possible laser system setup. Get free material testing to ensure your application will work.

    FALIT? History


    Semiconductor Application Experience

    1972 – Invented the laser marking application for silicon wafers.

    1985 – Developed laser processing and automation applications for wafers.

    1992 – Developed an automatic laser processing system for the BGA package.

    Brand Establishment

    2001 – CLC launched an IC chip failure analysis R&D project.

    2004 – Registered patent in the USA, Europe, and key Asia pacific countries.

    2009 – Gained significant market share of the high-end semiconductor customer segment, FALIT becomes the name of laser de-capsulation and cross-sectioning.

    2011 – Launched FALIT software version 3.0

    Brand Evolution

    2010 – Developed 1st?overseas distributor.

    2013 – Introduced a newly customized laser source to successfully handle multiple types of semiconductors.

    2015 – Launched video microscope system version 4.0, resolves the issue of IC de-cap, and cross-sectioning of super small sensors.

    2017 – Launched FALIT-TRIO, resolves the issue of new material used in semiconductor packaging

    Summary
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    Brand Name
    FALIT
    Product Name
    FALIT Laser System
    Price
    USD Starts from 61.6K
    Product Availability
    Available in Stock

    Get an Online Quote

    Build and quote a system using our online quote builder

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    Machine/System Financing

    From startups to large business

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    Contact CLC

    Speak with a sales representative about a system

    Contact Us

    Free tests for your workpiece samples!

    Match your application with right machine configuration before you buy

    Contact Us (407) 926-3500 Price Match Online Order Guide
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